Your Chips and Semi News
7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.
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An update on TSMC current and forthcoming logic process nodes as well as their next-generation advanced packaging technologies.
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An update on the current state of EUV systems which was given by ASML at SEMICON West 2019 earlier this month.
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Samsung gives an update on their 7nm EUV-based process, details the foundry technology roadmap down to 3nm and the ARM ecosystem that follows.
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